The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
Jan. 23, 2004
Applicants:
Yuichi Hirata, Nagoya, JP;
Hironobu Suzuki, Nagoya, JP;
Inventors:
Yuichi Hirata, Nagoya, JP;
Hironobu Suzuki, Nagoya, JP;
Assignee:
Chuo Hatsujo Kabushiki Kaisha, Nagoya-shi, Aichi-ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 15/16 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for fabricating a filtering member in which overlapping portions of a wire are bonded together in a layered manner through thermal treatment for forming a mesh is disclosed. In accordance with the method, a contact surface pressure between portions of the wire to be bonded together is maintained as equal to or higher than a predetermined level set depending on a thermal treatment condition. In this state, the thermal treatment is conducted such that a bonding portion of the wire has a strength equal to or greater than 4N.