The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2009

Filed:

Sep. 14, 2005
Applicant:

Terukazu Otsuki, Nara, JP;

Inventor:

Terukazu Otsuki, Nara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An enclosure is formed by folding an FPC board having, on the top face thereof, electronic components and, on the back face thereof, a ground conductor pattern in such a way that the electronic components mounted thereon are housed inside the enclosure. The electronic components housed inside the enclosure are covered with the ground conductor pattern. This means that the enclosure serves as a shield enclosure that electromagnetically shields at least part of the electronic components from the outside. In this way, the shield enclosure is formed by folding the FPC board. This makes it possible to realize an electromagnetic shield structure without using an extra shield case as used in the conventional modules.


Find Patent Forward Citations

Otsuki, Terukazu. (2009). Radio frequency module and manufacturing method thereof (U.S. Patent No. 7639513). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7639513

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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