The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2009
Filed:
Jun. 24, 2008
Levi A. Campbell, Poughkeepsie, NY (US);
Richard C. Chu, Hopewell Junction, NY (US);
Michael J. Ellsworth, Jr., Lagrangeville, NY (US);
Madhusudan K. Iyengar, Woodstock, NY (US);
Randall G. Kemink, Poughkeepsie, NY (US);
Roger R. Schmidt, Poughkeepsie, NY (US);
Robert E. Simons, Poughkeepsie, NY (US);
Levi A. Campbell, Poughkeepsie, NY (US);
Richard C. Chu, Hopewell Junction, NY (US);
Michael J. Ellsworth, Jr., Lagrangeville, NY (US);
Madhusudan K. Iyengar, Woodstock, NY (US);
Randall G. Kemink, Poughkeepsie, NY (US);
Roger R. Schmidt, Poughkeepsie, NY (US);
Robert E. Simons, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.