The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2009
Filed:
Oct. 11, 2007
Kazuaki Watanabe, Nagoya, JP;
Kazuaki Watanabe, Nagoya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
An ultrasonic sensor includes a resin substrate and an ultrasonic oscillator. The ultrasonic oscillator is provided approximately at the center of a component side of the resin substrate and generates and detects an ultrasonic wave. The resin substrate is made of, for example, a polycarbonate resin, i.e., the same material as a car bumper, and is shaped into a flat plate. The component side of the resin substrate is provided with a padadjacent to the ultrasonic oscillator. The pad is used for metal wiring based on wire bonding. The pad is made of a hard metal material excellent in conductivity and heat resistance such as stainless steel, and Al or Al alloy, for example. The resin substrate is formed as a single piece through insert molding by pouring a melted resin. Through this process, the pad is provided for the component side of the resin substrate.