The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2009
Filed:
Apr. 11, 2007
Chia-wen Chiang, Hsinchu, TW;
Chia-Wen Chiang, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A packaging structure including an interposer structure, a first electronic component, and a second electronic component is provided. The interposer structure includes a first dielectric layer, a plurality of contacts, a capacitive element, and an interconnection. The contacts are disposed on the upper and lower surfaces of the first dielectric layer and the capacitive element, which comprises two conductive layers and a second dielectric layer located among the layers, is embedded into the first dielectric layer. And the interconnection is embedded into the first dielectric layer, while the capacitive element electrically connects to the corresponding contacts through the interconnection. The first and the second electronic components are disposed respectively on the upper and bottom sides of the interposer structure and electrically connected to the corresponding contacts.