The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2009

Filed:

Sep. 19, 2007
Applicants:

Hiroaki Morita, Aichi, JP;

Tomohiro Shiotani, Kanagawa, JP;

Shinji Kubota, Aichi, JP;

Kaoru Abe, Kanagawa, JP;

Inventors:

Hiroaki Morita, Aichi, JP;

Tomohiro Shiotani, Kanagawa, JP;

Shinji Kubota, Aichi, JP;

Kaoru Abe, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is to provide a thin film semiconductor device including a semiconductor thin film and an interlayer insulating film configured to cover the semiconductor thin film. In the interlayer insulating film, a hydrogen supply part and a blocking part against contamination are deposited in that order from a semiconductor thin film side.


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