The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7638369 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 29, 2009

Filed:

Feb. 03, 2006
Applicants:

Takashi Sakoh, Kanagawa, JP;

Ryo Kubota, Kanagawa, JP;

Inventors:

Takashi Sakoh, Kanagawa, JP;

Ryo Kubota, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/86 (2006.01); H01L 21/475 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a semiconductor chip having fuses. The semiconductor chip includes fuses each having a first terminal electrically connected to a first logic circuit, a second terminal electrically connected to a second logic circuit, and a blowable region formed between the first terminal and the second terminal; and fuse residues each having the same patterns with those of the first terminal and the second terminal of the fuses, and configured so that patterns corresponded to the first terminals and the second terminals are electrically disconnected from each other.


Find Patent Forward Citations

Sakoh, Takashi. (2009). Semiconductor chip and method of fabricating the same (U.S. Patent No. 7638369). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7638369

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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