The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2009

Filed:

Jul. 31, 2007
Applicants:

Ming-dah Liu, Hsinchu, TW;

Shi-chi Hou, Hsinchu, TW;

Jui-nien Jao, Hsinchu, TW;

Inventors:

Ming-Dah Liu, Hsinchu, TW;

Shi-Chi Hou, Hsinchu, TW;

Jui-Nien Jao, Hsinchu, TW;

Assignee:

Coretronic Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a mold of a light guide plate is disclosed. The method includes following steps: providing a substrate and forming a plurality of microstructures on the substrate; depositing a first metal layer upon the substrate; spreading a photoresist layer on the first metal layer, exposing the photoresist layer to a photomask, and developing a photoresist pattern; removing a part of the first metal layer without cover of the photoresist pattern so as to form a sink pattern; depositing a second metal layer upon the sink pattern; electroforming a metal plate on the second metal layer; and remaining the metal plate and the second metal layer by separating the metal plate from the photoresist layer, the first metal layer, and the substrate so as to generate the mold of the light guide plate.


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