The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2009
Filed:
Oct. 07, 2003
Tomoyuki Obara, Ichihara, JP;
Katsuhiko Tada, Ichihara, JP;
Tomoyuki Obara, Ichihara, JP;
Katsuhiko Tada, Ichihara, JP;
Prime Polymer Co., Ltd., Tokyo, JP;
Abstract
A molding method which includes charging a resin composition in molten state containing not less than 7 wt % to less than 30 wt % of a fibrous fiber (A) and more than 70 wt % to not exceeding 93 wt % of a resin (B) into a die for shaping purpose when a temperature of the die is in the range of [the Vicat softening point minus 20° C.] of resin (B) to less than a melting point thereof, when resin (B) is crystalline resin, or when a temperature of the die is in the range of [the Vicat softening point minus 20° C.] to [the Vicat softening point plus 20° C.] of the resin (B), when resin (B) is non-crystalline resin, cooling the die after shaping to temperature which allows taking-out of a molded product.