The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2009
Filed:
Jul. 11, 2008
Timothy Brooks Bambridge, Pittstown, NJ (US);
John Wayne Bowen, Warminster, PA (US);
John Mckenna Brennan, Wyomissing, PA (US);
Joseph Michael Freund, Fogelsville, PA (US);
Timothy Brooks Bambridge, Pittstown, NJ (US);
John Wayne Bowen, Warminster, PA (US);
John McKenna Brennan, Wyomissing, PA (US);
Joseph Michael Freund, Fogelsville, PA (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.