The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2009
Filed:
Feb. 16, 2007
Feng Zhao, Issaquah, WA (US);
Nissanka B. Priyantha, Redmond, WA (US);
Dimitrios Lymperopoulos, Redmond, WA (US);
Feng Zhao, Issaquah, WA (US);
Nissanka B. Priyantha, Redmond, WA (US);
Dimitrios Lymperopoulos, Redmond, WA (US);
Microsoft Corporation, Redmond, WA (US);
Abstract
A smart interconnect for modular multi-component embedded devices is described. In an embodiment of a smart interconnect for modular multi-component embedded devices, a desired functionality of a stack of hardware boards is accessed. For example, a user may select a new functionality for the stack of hardware boards. The desired functionality is then transmitted to a board in the stack of hardware boards and the board is configured to implement the desired functionality of the stack of hardware boards.