The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2009
Filed:
Nov. 20, 2006
Applicants:
Norifumi Tokuda, Tokyo, JP;
Shigeru Kusunoki, Tokyo, JP;
Inventors:
Norifumi Tokuda, Tokyo, JP;
Shigeru Kusunoki, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device has a semiconductor substrate having a first main surface, a second main surface opposite to the first main surface, and a recess defined in the second main surface by side surfaces and a bottom surface, a semiconductor region provided in the bottom surface of the recess of the semiconductor substrate, semiconductor regions provided in the surface of a peripheral region on the second main surface side, and insulating films provided on the side surfaces of the recess to electrically insulate the semiconductor regions.