The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2009

Filed:

Jun. 27, 2005
Applicants:

Bernhard P. Lange, Garland, TX (US);

Steven A. Kummerl, Carrollton, TX (US);

Inventors:

Bernhard P. Lange, Garland, TX (US);

Steven A. Kummerl, Carrollton, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device comprising a leadframe (), which has first () and second () surfaces, a planar pad () of a certain size, and a plurality of non-coplanar members () adjoining the pad. The device further has a heat spreader () with first () and second () surfaces, a planar pad of a size matching the leadframe pad size, and contours (), into which the leadframe members are inserted so that the first spreader pad surface touches the second leadframe pad surface across the pad size. A semiconductor chip () is mounted on the first leadframe pad surface. Encapsulation material (), preferably molding compound, covers the chip, but leaves the second spreader surface uncovered.


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