The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7635608 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 22, 2009

Filed:

Oct. 30, 2006
Applicants:

Tsung-hsien Lin, Hsinchu, TW;

Jia-chong Ho, Hsinchu County, TW;

Tarng-shiang HU, Hsinchu, TW;

Cheng-chung Lee, Taitung, TW;

Inventors:

Tsung-Hsien Lin, Hsinchu, TW;

Jia-Chong Ho, Hsinchu County, TW;

Tarng-Shiang Hu, Hsinchu, TW;

Cheng-Chung Lee, Taitung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 51/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A fabricating method of organic electronic device is provided. The method comprises: providing a flexible substrate; fabricating a plurality of organic elements on the flexible substrate; fabricating a patterned spacing layer on the flexible substrate; and arranging a cover substrate on the patterned spacing layer, and sealing the edges of the flexible substrate and the cover substrate with a sealant, wherein the patterned spacing layer is used to maintain a space between the flexible substrate and the cover substrate.


Find Patent Forward Citations

Lin, Tsung-Hsien. (2009). Method of fabricating organic electronic device (U.S. Patent No. 7635608). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7635608

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