The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2009
Filed:
Feb. 06, 2006
Applicants:
Tadashi Ariga, Oiso-machi, JP;
Kiichi Kanda, Hiratsuka, JP;
Inventors:
Tadashi Ariga, Oiso-machi, JP;
Kiichi Kanda, Hiratsuka, JP;
Assignee:
Kanto Yakin Kogyo Kabushiki Kaisha, Kanagawa-ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 28/00 (2006.01); B23K 1/20 (2006.01); B23K 5/213 (2006.01); B23K 20/24 (2006.01); B23K 35/12 (2006.01); B22F 1/00 (2006.01); C22C 1/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
This invention relates to a method of brazing while the thickness of the opening between materials being brazed can not be maintained constant or can not be adjusted in the appropriate range. In order to solve this issue the porous material of metals or metal alloys consisting of Ni, Cu, Ti, Al, Ag or W should be utilized. The metallic porous material is inserted into the brazing opening mentioned above by using the softness of it, and is made to hold the brazing solder and to reinforce the bonding part after brazing.