The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2009

Filed:

Jan. 08, 2008
Applicants:

Hee Sung Choi, Gyeonggi-do, KR;

Seoung Jae Lee, Gyeonggi-do, KR;

Yeoung Jin Lee, Gyeonggi-do, KR;

Sung Han Won, Seoul, KR;

Ha Yong Jung, Gyeonggi-do, KR;

Hyun Ho Shin, Gyeonggi-do, KR;

Jung Tae Park, Seoul, KR;

Jae Youn Jeong, Gyeonggi-do, KR;

Inventors:

Hee Sung Choi, Gyeonggi-do, KR;

Seoung Jae Lee, Gyeonggi-do, KR;

Yeoung Jin Lee, Gyeonggi-do, KR;

Sung Han Won, Seoul, KR;

Ha Yong Jung, Gyeonggi-do, KR;

Hyun Ho Shin, Gyeonggi-do, KR;

Jung Tae Park, Seoul, KR;

Jae Youn Jeong, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 9/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one end is inserted into the capacitor element and the other end projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the conductive bumps.


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