The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2009
Filed:
May. 28, 2004
Kenichi Matsumoto, Osaka, JP;
Tetsuo Murakami, Osaka, JP;
Toshiharu Fukui, Nara, JP;
Panasonic Corporation, Osaka, JP;
Abstract
An upper substrate that has upper conductive layer formed on a bottom surface thereof, is bonded to lower substrate, that has lower conductive layer opposed to the upper conductive layer with a predetermined space held therebetween, on a top surface of lower substrate by an adhesive layer that is made of a thermoplastic resin containing a tackifier dispersed therein, with a bonding property of the adhesive layer being enhanced by pressing. Addition of the tackifier increases flexibility of the adhesive layer and performs bonding with a large adhesive area at pressing. Thus, a width of the adhesive layer can be as small as approximately 1 to 1.5 mm. This can provide a smaller touch panel ensuring a predetermined touch sensitive area.