The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2009
Filed:
Mar. 16, 2007
Applicants:
Seah Sun Too, San Jose, CA (US);
Jacquana Diep, San Jose, CA (US);
Mohammad Khan, San Jose, CA (US);
Inventors:
Seah Sun Too, San Jose, CA (US);
Jacquana Diep, San Jose, CA (US);
Mohammad Khan, San Jose, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/12 (2006.01); H01L 23/49 (2006.01); H01L 21/58 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
Various integrated circuit packages, lids therefor and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing an integrated circuit package lid that has a surface adapted to face towards an integrated circuit, and forming a wetting film on the surface. The wetting film has at least one void where the surface of the lid is exposed. The void inhibits bonding so that a stress reduction site is produced.