The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2009

Filed:

Feb. 15, 2007
Applicants:

Yuji Awano, Kawasaki, JP;

Masataka Mizukoshi, Kawasaki, JP;

Taisuke Iwai, Kawasaki, JP;

Tomoji Nakamura, Kawasaki, JP;

Inventors:

Yuji Awano, Kawasaki, JP;

Masataka Mizukoshi, Kawasaki, JP;

Taisuke Iwai, Kawasaki, JP;

Tomoji Nakamura, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

A plurality of conductive pads () are formed on a mounting surface of a mounting board. Conductive pads () are formed on a principal surface of a semiconductor chip () at positions corresponding to the conductive pads of the mounting board, when the principal surface faces toward the mounting board. A plurality of conductive nanotubes () extend from the conductive pads of one of the mounting board and the semiconductor chip. A press mechanism () presses the semiconductor chip against the mounting board and restricts a position of the semiconductor chip on the mounting surface to mount the semiconductor chip on the mounting board, in a state that tips of the conductive nanotubes are in contact with the corresponding conductive pads not formed with the conductive nanotubes.


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