The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2009
Filed:
Dec. 09, 2003
Leeshawn Luo, Santa Clara, CA (US);
Anup Bhalla, Santa Clara, CA (US);
Sik K. Lui, Sunnyvale, CA (US);
Yueh-se Ho, Sunnyvale, CA (US);
Mike F. Chang, Cupertino, CA (US);
Xiao Tiang Zhang, San Jose, CA (US);
Leeshawn Luo, Santa Clara, CA (US);
Anup Bhalla, Santa Clara, CA (US);
Sik K. Lui, Sunnyvale, CA (US);
Yueh-Se Ho, Sunnyvale, CA (US);
Mike F. Chang, Cupertino, CA (US);
Xiao Tiang Zhang, San Jose, CA (US);
Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);
Abstract
A semiconductor package includes a lead frame having a plurality of leads and a lead frame pad, the lead frame pad including a die coupled thereto, at least one of the plurality of leads having an external portion sloped upwards relative to a bottom surface of the package, metal connectors connecting the die to the plurality of leads, and a resin body encapsulating the die, metal connectors and at least a portion of the lead frame.