The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2009
Filed:
Apr. 21, 2009
Kenji Ishii, Tokyo, JP;
Yasumasa Norisue, Tokyo, JP;
Kiyonari Hiramatsu, Tokyo, JP;
Makoto Miyamoto, Tokyo, JP;
Makoto Yamazaki, Tokyo, JP;
Daisuke Ohno, Tokyo, JP;
Kenji Ishii, Tokyo, JP;
Yasumasa Norisue, Tokyo, JP;
Kiyonari Hiramatsu, Tokyo, JP;
Makoto Miyamoto, Tokyo, JP;
Makoto Yamazaki, Tokyo, JP;
Daisuke Ohno, Tokyo, JP;
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Abstract
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.