The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2009
Filed:
Apr. 07, 2004
Tetsuya Iida, Tsurugashima, JP;
Masahiro Katsumura, Tsurugashima, JP;
Tetsuya Iida, Tsurugashima, JP;
Masahiro Katsumura, Tsurugashima, JP;
Pioneer Corporation, Tokyo, JP;
Abstract
The present invention relates to a stamper used for an injection molding of a resin material and a manufacturing method thereof. It is provided with such stamper as being excellent in durability in use without causing corrosion at a portion contacting with the resin material, wherein an anti-corrosion film made of any one of alloy selected from a nickel alloy, a silver alloy or a copper alloy is formed on a surface of the stamper contacting with the resin material. Further, it is provided with a method comprising steps of: forming anti-corrosion film on the surface of a mold for manufacturing the stamper; forming the stamper on the anti-corrosion film; and separating the stamper and the anti-corrosion film in a body from the mold.