The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2009

Filed:

Aug. 13, 2007
Applicants:

Avery Y. Quil, San Pedro, CA (US);

Clifton Quan, Arcadia, CA (US);

Alec Ekmekji, Los Angeles, CA (US);

Jason G. Milne, El Segundo, CA (US);

Inventors:

Avery Y. Quil, San Pedro, CA (US);

Clifton Quan, Arcadia, CA (US);

Alec Ekmekji, Los Angeles, CA (US);

Jason G. Milne, El Segundo, CA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 13/00 (2006.01); H01Q 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.


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