The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Jul. 24, 2003
Takahiro Fukagawa, Ogori, JP;
Yuji Otake, Fukuoka, JP;
Takashi Katsuki, Onojyo, JP;
Minoru Murakami, Chikushino, JP;
Kimiyuki Yamasaki, Ogori, JP;
Takahiro Fukagawa, Ogori, JP;
Yuji Otake, Fukuoka, JP;
Takashi Katsuki, Onojyo, JP;
Minoru Murakami, Chikushino, JP;
Kimiyuki Yamasaki, Ogori, JP;
Panasonic Corporation, Osaka, JP;
Abstract
To provide a printing inspection apparatus and a printing inspection method enabling an optimal inspection mode in which a balance is kept between the improvement of production efficiency and the securing of a printing accuracy. In a printing inspection for inspecting a printing state of cream solder on a substrate after screen printing, inspection data is generated by dividing unit shape and position data, indicating the shapes and the positions of element solder print portions to be printed on electrodes provided on a circuit forming surface of the substrate to be used to bond electronic components, into data groups according to a grouping condition chosen in response to an inspection mode. A go/no-go judgment at the time of inspection is made per data group, and a judgment result is displayed for each data group. It is thus possible to choose an optimal inspection mode flexibly in response to the characteristics of a substrate as the subject to be inspected.