The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2009

Filed:

Nov. 07, 2006
Applicant:

Yoshimi Takahashi, Beppu, JP;

Inventor:

Yoshimi Takahashi, Beppu, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

A device with a semiconductor chip assembled on a planar substrate and encapsulation compound surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area. The encapsulation compound has a plurality of side areas reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.


Find Patent Forward Citations

Takahashi, Yoshimi. (2009). Plastic semiconductor package having improved control of dimensions (U.S. Patent No. 7629696). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7629696

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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