The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Jul. 12, 2006
Chong Ho Kim, Chungcheongbuk-do, KR;
Jong Min Choi, Chungcheongbuk-do, KR;
Young Hwan Shin, Daejeon, KR;
Chong Ho Kim, Chungcheongbuk-do, KR;
Jong Min Choi, Chungcheongbuk-do, KR;
Young Hwan Shin, Daejeon, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A via hole having a fine hole land includes a first conductive layer formed on an inner wall of the via hole, the first conductive layer being in contact with a hole formed in an insulation layer and extendedly projected to the outside and having the same diameter as the hole in the insulation layer; a second conductive layer contacted with the first conductive layer and formed on an inner wall thereof and projected to the outside and having the same height as the first conductive layer; and a circuit line, formed on the insulation layer, to connect the first conductive layer extendedly projected to the outside of hole in the insulation layer, where the second conductive layer has the same height as the first conductive layer and the fine hole land is connected to wire bonding pad or solder ball pad through the circuit line.