The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Jan. 11, 2005
Applicant:
Jun Maeda, Mihama-ku, JP;
Inventor:
Jun Maeda, Mihama-ku, JP;
Assignee:
Kawasaki Microelectronics, Inc., Chiba, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor integrated circuit having connection pads arranged over active elements is disclosed. The connection pad is divided into a probing area and a bonding area, and reinforcing structures are formed separately under the respective areas. The reinforcing structure under the probing area is formed using a number of wiring layers less than the number of wiring layers used for forming the reinforcing structure under the bonding area. As a result, the wiring layers under the probing area are efficiently utilized to forms wires for realizing the logical function of the integrated circuit.