The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Oct. 25, 2006
Applicants:
Young Bok Yoon, Kyungki-do, KR;
Dong Jin Kim, Seoul, KR;
Jin Woo Park, Kyungki-do, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Kyungki-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a semiconductor device package. The semiconductor device package includes at least one semiconductor device acting as a heating source, a package substrate having an upper surface on which the semiconductor device is mounted, the package substrate at least having a higher heat conductivity than that of the semiconductor device, and a fiber-reinforced polymer composite formed to surround a side surface of the package substrate, the polymer composite including fibers acting as a reinforcing material and a resin mass embedding the fibers therein.