The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Nov. 23, 2005
Hee-jin Park, Chungcheongnam-do, KR;
Hee-Jin Park, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package includes a printed circuit board, a semiconductor chip mounted on the printed circuit board, a wire structured to electrically connect the printed circuit board to the semiconductor chip, and an encapsulant that protects the semiconductor chip and the wire, the encapsulant disposed on the printed circuit board such that the encapsulant covers a surface of the printed in an edge region of the printed circuit board and exposes another surface of the printed circuit board in another edge region of the printed circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile