The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Dec. 01, 2006
Applicants:
Tetsuya Kanata, Toyota, JP;
Shinichi Umekawa, Himeji, JP;
Koji Terada, Himeji, JP;
Yasushi Takahashi, Kanazawa, JP;
Inventors:
Tetsuya Kanata, Toyota, JP;
Shinichi Umekawa, Himeji, JP;
Koji Terada, Himeji, JP;
Yasushi Takahashi, Kanazawa, JP;
Assignees:
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device is provided with a semiconductor substrate having circuit elements formed therein, and an insulating protective film formed on the semiconductor substrate. Hydroxyl groups (OH) are attached to a surface of the protective film. As a result, the contact angle between surface of the protective film and a water droplet is less than or equal to 40 degrees.