The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Jun. 13, 2005
Markus Naujok, Hopewell Junction, NY (US);
Hermann Wendt, Poughkeepsie, NY (US);
Alois Gutmann, Poughkeepsie, NY (US);
Muhammed Shafi Pallachalil, Wappingers Falls, NY (US);
Markus Naujok, Hopewell Junction, NY (US);
Hermann Wendt, Poughkeepsie, NY (US);
Alois Gutmann, Poughkeepsie, NY (US);
Muhammed Shafi Pallachalil, Wappingers Falls, NY (US);
Infineon Technologies AG, Munich, DE;
Abstract
Methods of forming air gaps between interconnects of integrated circuits and structures thereof are disclosed. A first insulating material is deposited over a workpiece, and a second insulating material having a sacrificial portion is deposited over the first insulating material. Conductive lines are formed in the first and second insulating layers. The second insulating material is treated to remove the sacrificial portion, and at least a portion of the first insulating material is removed, forming air gaps between the conductive lines. The second insulating material is impermeable as deposited and permeable after treating it to remove the sacrificial portion. A first region of the workpiece may be masked during the treatment, so that the second insulating material becomes permeable in a second region of the workpiece yet remains impermeable in the first region, thus allowing the formation of the air gaps in the second region, but not the first region.