The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2009

Filed:

Dec. 31, 2007
Applicants:

Charles N. Dornfest, Fremont, CA (US);

Deepak Upadhyaya, Fremont, CA (US);

William John Boardman, Danville, CA (US);

Karthik Boinapally, Fremont, CA (US);

Inventors:

Charles N. Dornfest, Fremont, CA (US);

Deepak Upadhyaya, Fremont, CA (US);

William John Boardman, Danville, CA (US);

Karthik Boinapally, Fremont, CA (US);

Assignee:

Sub-One Technology, Inc., Pleasanton, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05H 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Plasma Enhanced Bonding (PEB) during a coating process is used to improve both adhesion and corrosion resistance of the resulting coating. New interfacial compounds may be formed, offering the increased resistance to corrosion, as well as enhanced bonding to the workpiece being coated and any subsequently formed layer, such as diamond-like carbon. In one embodiment, the PEB processing is employed during coating of at least one interior surface of the workpiece, which may be a pipe. In a first step, a thin film is deposited. Then, the film is exposed to a high energy etch-back plasma. This two-step cycle of depositing a film and then providing bombardment of the film may be repeated a number of times. Typically, the deposition step of the cycle is much shorter than the bombardment step.


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