The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2009
Filed:
Oct. 04, 2002
Toivo T. Kodas, Albuquerque, NM (US);
Mark J. Hampden-smith, Albuquerque, NM (US);
Karel Vanheusden, Placitas, NM (US);
Hugh Denham, Albuquerque, NM (US);
Aaron D. Stump, Albuquerque, NM (US);
Allen B. Schult, Albuquerque, NM (US);
Paolina Atanassova, Albuquerque, NM (US);
Klaus Kunze, Half Moon Bay, CA (US);
Toivo T. Kodas, Albuquerque, NM (US);
Mark J. Hampden-Smith, Albuquerque, NM (US);
Karel Vanheusden, Placitas, NM (US);
Hugh Denham, Albuquerque, NM (US);
Aaron D. Stump, Albuquerque, NM (US);
Allen B. Schult, Albuquerque, NM (US);
Paolina Atanassova, Albuquerque, NM (US);
Klaus Kunze, Half Moon Bay, CA (US);
Cabot Corporation, Boston, MA (US);
Abstract
A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes copper metal for the formation of highly conductive copper features.