The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2009

Filed:

Jul. 10, 2006
Applicants:

Kazuyuki Yamamoto, Saitama, JP;

Takayuki Ogino, Saitama, JP;

Akihiro Ito, Saitama, JP;

Seiichiro Okamura, Ibaraki, JP;

Tomokazu Yamashita, Ibaraki, JP;

Inventors:

Kazuyuki Yamamoto, Saitama, JP;

Takayuki Ogino, Saitama, JP;

Akihiro Ito, Saitama, JP;

Seiichiro Okamura, Ibaraki, JP;

Tomokazu Yamashita, Ibaraki, JP;

Assignee:

Hoya Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/05 (2006.01); A61B 1/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

An image capturing unit for an electronic endoscope is provided with a solid-state image capturing element having multiple boding wires arranged at peripheral positions on a front surface of the solid-state image capturing element, the bonding wires extending outward, an image capturing element holding frame in which the solid-state image capturing element is held and a transparent cover glass enclosing the front surface of the solid-state image capturing element from outside, together with a tip end portion of the image capturing element holding frame. The tip end portion of the image capturing element holding frame is formed to have a tubular section, the cover glass being fitted in the tubular section and located at a position where the cover glass does not contact the bonding wires, the cover glass being air-tightly cemented to the tubular section.


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