The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2009
Filed:
Sep. 19, 2005
Applicants:
Daisuke Hobara, Kanagawa, JP;
Shinichiro Kondo, Tokyo, JP;
Inventors:
Daisuke Hobara, Kanagawa, JP;
Shinichiro Kondo, Tokyo, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 35/24 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes conductor or semiconductor fine particles, and organic semiconductor molecules bonded to the fine particles to form a conductive path, the conductivity of the conductive path being controlled by an electric field. In the semiconductor device, protective film molecules bonding to the adjacent fine particles bond to each other to form the organic semiconductor molecules which connect the fine particles to each other.