The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2009
Filed:
Nov. 04, 2008
Markus Lutz, Palo Alto, CA (US);
Aaron Partridge, Palo Alto, CA (US);
Wilhelm Frey, Stuttgart, DE;
Markus Ulm, Menlo Park, CA (US);
Matthias Metz, Palo Alto, CA (US);
Brian Stark, San Francisco, CA (US);
Gary Yama, Mountain View, CA (US);
Markus Lutz, Palo Alto, CA (US);
Aaron Partridge, Palo Alto, CA (US);
Wilhelm Frey, Stuttgart, DE;
Markus Ulm, Menlo Park, CA (US);
Matthias Metz, Palo Alto, CA (US);
Brian Stark, San Francisco, CA (US);
Gary Yama, Mountain View, CA (US);
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.