The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2009

Filed:

Dec. 13, 2007
Applicants:

LI Zhang, San Jose, CA (US);

Frank M. Steranka, San Jose, CA (US);

Frank J. Wall, Jr., Vacaville, CA (US);

Jeff Kmetec, Palo Alto, CA (US);

Johannes Wilhelmus Weekamp, Beek en Donk, NL;

Inventors:

Li Zhang, San Jose, CA (US);

Frank M. Steranka, San Jose, CA (US);

Frank J. Wall, Jr., Vacaville, CA (US);

Jeff Kmetec, Palo Alto, CA (US);

Johannes Wilhelmus Weekamp, Beek en Donk, NL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A light emitting diode (LED) apparatus for mounting to a heat sink having a front surface with an opening therein is disclosed. The apparatus includes a sub-mount, at least one LED die mounted on the sub-mount, and a thermally conductive slug having first and second areas. The first area is thermally coupled to the sub-mount and the second area has a post protruding outwardly therefrom. The post is operably configured to be received in the opening in the heat sink and to secure the LED apparatus to the heat sink such that the second area is thermally coupled to the front surface of the heat sink. Other embodiments for mounting an LED apparatus utilizing adhesive thermally conductive material, spring clips, insertion snaps, or welding are also disclosed.


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