The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2009
Filed:
May. 30, 2007
Youn-sung Ko, Cheonan-si, KR;
Hak-kyoon Byun, Asan-si, KR;
Jung-hwan Woo, Cheonan-si, KR;
Hyun-jung Song, Yongin-si, KR;
Youn-sung Ko, Cheonan-si, KR;
Hak-kyoon Byun, Asan-si, KR;
Jung-hwan Woo, Cheonan-si, KR;
Hyun-jung Song, Yongin-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.