The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2009

Filed:

Dec. 05, 2007
Applicants:

Makoto Higaki, Kawasaki, JP;

Kazuhiro Inoue, Inagi, JP;

Shuichi Sekine, Yokohama, JP;

Akihiro Tsujimura, Ome, JP;

Inventors:

Makoto Higaki, Kawasaki, JP;

Kazuhiro Inoue, Inagi, JP;

Shuichi Sekine, Yokohama, JP;

Akihiro Tsujimura, Ome, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 15/02 (2006.01); H01Q 15/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided with a high-impedance substrate including: a finite ground plane; a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane; and a plurality of linear conductive elements configured to connect the plurality of metal plates to the finite ground plane and, wherein outer metal plates arranged at an outermost periphery among the plurality of metal plates are connected with the linear conductive elements at edges of the outer metal plates.


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