The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2009

Filed:

Oct. 20, 2006
Applicants:

Eric D. Hobbs, Livermore, CA (US);

Alexander H. Slocum, Bow, NH (US);

Benjamin N. Eldridge, Danville, CA (US);

Keith J. Breinlinger, San Ramon, CA (US);

Shawn Powell, Pleasant Hill, CA (US);

Inventors:

Eric D. Hobbs, Livermore, CA (US);

Alexander H. Slocum, Bow, NH (US);

Benjamin N. Eldridge, Danville, CA (US);

Keith J. Breinlinger, San Ramon, CA (US);

Shawn Powell, Pleasant Hill, CA (US);

Assignee:

FormFactor, Inc., Livermore, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.


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