The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2009

Filed:

May. 02, 2006
Applicants:

Koichi Endo, Tokyo, JP;

Yasuto Sumi, Kawasaki, JP;

Katsuyuki Adachi, Fuchu, JP;

Inventors:

Koichi Endo, Tokyo, JP;

Yasuto Sumi, Kawasaki, JP;

Katsuyuki Adachi, Fuchu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/10 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device comprises a plurality of semiconductor elements; and a first wire and a second wire provided to connect the semiconductor elements in parallel. The first wire and the second wire include respective wires formed in multiple wiring layers. Each wiring layer includes the first wire and the second wire formed alternately and in parallel. The wires are formed as to intersect each other in adjacent wiring layers. The first wires are connected with each other through a via-connection at an intersection of the first wires and the second wires are connected with each other through a via-connection at an intersection of the second wires.


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