The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2009

Filed:

Sep. 16, 2005
Applicants:

Katsuaki Aida, Ichihara, JP;

Hiroyuki Machida, Ichihara, JP;

Kazuyuki Haneda, Ichihara, JP;

Inventors:

Katsuaki Aida, Ichihara, JP;

Hiroyuki Machida, Ichihara, JP;

Kazuyuki Haneda, Ichihara, JP;

Assignee:

Showa Denko K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 5/82 (2006.01); G11B 5/73 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a substrate which is not substantially chipped or cracked on the substrate end faces even when the substrate is a silicon substrate made of a brittle material, and provide a substrate which prevents dust raising from the substrate end faces and prevents dust raising due to rubbing with a processing cassette. A silicon substrate for a magnetic recording medium is formed by setting the lengths L of chamfered portions between the main surfaces of the substrate and the outer circumferential side end face to 0.1±0.03 mm and setting the angles α between the main surfaces and the chamfered portions between the main surfaces and the outer circumferential side end face to 45 degrees ±5 degrees. It is also possible for a curved portion with a radius of 0.01 mm or more and less than 0.3 mm is interposed between the main surfaces and the outer circumferential side chamfered portions of the substrate.


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