The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2009
Filed:
Jun. 23, 2006
Justin Quarantello, Higley, AZ (US);
Thomas Laursen, New Haven, CT (US);
Karl Kasprzyk, Gilbert, AZ (US);
Rob Stoya, Cave Creek, AZ (US);
Justin Quarantello, Higley, AZ (US);
Thomas Laursen, New Haven, CT (US);
Karl Kasprzyk, Gilbert, AZ (US);
Rob Stoya, Cave Creek, AZ (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
Methods are provided for chemical mechanical planarization of a layer and for determining the endpoint of a CMP operation. In accordance with one embodiment the method for determining an endpoint comprises making a plurality of eddy current thickness measurement of the layer being planarized, each of the plurality of measurements spaced apart by a predetermined length of time. A difference is calculated between sequential ones of the plurality of eddy current measurements, and a predetermined minimum threshold for the difference is set. The endpoint is defined as a calculated difference less than the predetermined minimum threshold.