The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2009
Filed:
Jan. 08, 2008
Hee Sung Choi, Gyeonggi-do, KR;
Seoung Jae Lee, Gyeonggi-do, KR;
Yeoung Jin Lee, Gyeonggi-do, KR;
Sung Han Won, Seoul, KR;
Ha Yong Jung, Gyeonggi-do, KR;
Hyun Ho Shin, Gyeonggi-do, KR;
Jung Tae Park, Seoul, KR;
Jae Youn Jeong, Gyeonggi-do, KR;
Hee Sung Choi, Gyeonggi-do, KR;
Seoung Jae Lee, Gyeonggi-do, KR;
Yeoung Jin Lee, Gyeonggi-do, KR;
Sung Han Won, Seoul, KR;
Ha Yong Jung, Gyeonggi-do, KR;
Hyun Ho Shin, Gyeonggi-do, KR;
Jung Tae Park, Seoul, KR;
Jae Youn Jeong, Gyeonggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Abstract
Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire inserted and connected to a lower portion of the capacitor element; a cathode extraction layer formed on the capacitor element; an anode lead frame provided on one side of the lower surface of the capacitor element so as to be electrically insulated from the cathode extraction layer, the anode lead frame having an insertion portion into which a projecting lower portion of the anode wire is inserted; a cathode lead frame provided on the other side of the lower surface of the capacitor element so as to be electrically connected to the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the lower end surface of the anode wire, the lower surface of the anode lead frame, and the lower surface of the cathode lead frame; an anode lead terminal provided on the molding portion so as to be electrically connected to the lower end surface of the anode wire and the lower surface of the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the lower surface of the cathode lead frame.