The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2009
Filed:
Nov. 03, 2006
Applicants:
Frank Huebinger, Poughkeepsie, NY (US);
Moosung Chae, Poughkeepsie, NY (US);
Armin Tilke, Dresden, DE;
Hermann Wendt, Poughkeepsie, NY (US);
Inventors:
Frank Huebinger, Poughkeepsie, NY (US);
Moosung Chae, Poughkeepsie, NY (US);
Armin Tilke, Dresden, DE;
Hermann Wendt, Poughkeepsie, NY (US);
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit interconnect structure includes a conductive line, a first barrier layer disposed on a bottom surface of conductive line, a second barrier layer disposed on the top surface of the conductive line, and an interlevel dielectric surrounding the conductive line.