The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2009
Filed:
Jun. 22, 2006
Jong-seok Kim, Hwanseong-si, KR;
In-sang Song, Seoul, KR;
Sang-hun Lee, Seoul, KR;
Sang-wook Kwon, Seongnam-si, KR;
Duck-hwan Kim, Goyang-si, KR;
Yun-kwon Park, Dongducheon-si, KR;
Hee-moon Jeong, Yongin-si, KR;
Young-tack Hong, Suwon-si, KR;
Che-heung Kim, Yongin-si, KR;
Seok-chul Yun, Suwon-si, KR;
Kuang-woo Nam, Seoul, KR;
Jong-seok Kim, Hwanseong-si, KR;
In-sang Song, Seoul, KR;
Sang-hun Lee, Seoul, KR;
Sang-wook Kwon, Seongnam-si, KR;
Duck-hwan Kim, Goyang-si, KR;
Yun-kwon Park, Dongducheon-si, KR;
Hee-moon Jeong, Yongin-si, KR;
Young-tack Hong, Suwon-si, KR;
Che-heung Kim, Yongin-si, KR;
Seok-chul Yun, Suwon-si, KR;
Kuang-woo Nam, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the lower substrate by a distance, and having a membrane layer on a lower surface of the upper substrate; a bimetal layer formed in the cavity of the upper substrate on the membrane layer; a heating layer formed on a lower surface of the membrane layer; and a contact member formed on a lower surface of the heating layer. The contact member can come into contact with or separate from the signal line. A method for manufacturing the MEMS switch includes preparing the upper and lower substrates and combining them so that a surface having the signal line faces a surface having the contact member and the upper and lower substrates are disposed apart by a distance.