The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2009
Filed:
Jan. 20, 2006
Applicants:
Sang-moon Lee, Yongin-si, KR;
Young-bu Kim, Seongnam-si, KR;
Jung-hye Kim, Suwon-si, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor substrate having a reference semiconductor chip and a method of assembling semiconductor chips using the same are provided. According to the method, a semiconductor substrate having a plurality of semiconductor chips is provided. An identification mark is made on a reference semiconductor chip among the semiconductor chips. The semiconductor substrate is aligned with reference to the reference semiconductor chip, so that an electrical die sorting test can be performed on the semiconductor chips on the semiconductor substrate.