The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2009

Filed:

Jun. 28, 2007
Applicants:

Douglas Munroe Beall, Painted Post, NY (US);

Isabelle Marie Melscoet-chauvel, Painted Post, NY (US);

Gregory Albert Merkel, Corning, NY (US);

Tinghong Tao, Big Flats, NY (US);

David John Thompson, Savona, NY (US);

Inventors:

Douglas Munroe Beall, Painted Post, NY (US);

Isabelle Marie Melscoet-Chauvel, Painted Post, NY (US);

Gregory Albert Merkel, Corning, NY (US);

Tinghong Tao, Big Flats, NY (US);

David John Thompson, Savona, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/12 (2006.01); B32B 3/26 (2006.01); B01D 39/20 (2006.01); C03C 10/08 (2006.01); C04B 35/64 (2006.01);
U.S. Cl.
CPC ...
Abstract

Substantially non-microcracked, porous, cordierite ceramic honeycomb bodies are provided. Although exhibiting moderately high thermal expansion (CTE) between 7×10to 16×10/° C. (25-800° C.), the honeycomb bodies exhibit relatively high thermal shock parameter (TSP), such as TSR≧525° C. by virtue of a high MOR/E ratio, and/or low E=E/Eand well interconnected porosity, as witnessed by a relatively high pore connectivity factor (PCF). A method of manufacturing the honeycomb ceramic structure is also provided.


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