The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2009

Filed:

May. 20, 2004
Applicants:

LI Tan, Ann Arbor, MI (US);

Yen-peng Kong, Singapore, SG;

Stella W. Pang, Ann Arbor, MI (US);

Albert F. Yee, Ann Arbor, MI (US);

Inventors:

Li Tan, Ann Arbor, MI (US);

Yen-Peng Kong, Singapore, SG;

Stella W. Pang, Ann Arbor, MI (US);

Albert F. Yee, Ann Arbor, MI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B44C 1/10 (2006.01); B44C 1/18 (2006.01); B44C 1/24 (2006.01); B32B 37/10 (2006.01); B32B 37/16 (2006.01); B32B 37/02 (2006.01); B05D 1/02 (2006.01); B05D 1/18 (2006.01); H01L 21/302 (2006.01); B44C 1/17 (2006.01); B32B 37/06 (2006.01); B05D 5/12 (2006.01); B05D 1/26 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of applying a pattern on a topography includes first applying a polymer film to an elastomer member, such as PDMS, to form a pad. The pad is then applied to a substrate having a varying topography under pressure. The polymer film is transferred to the substrate due to the plastic deformation of the polymer film under pressure compared to the elastic deformation of the PDMS member. Thus, upon removal of the pad from the substrate, the PDMS member pulls away from the polymer layer, thereby depositing the polymer layer upon the substrate.


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