The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2009
Filed:
Jan. 27, 2006
Hiroyuki Yamashina, Okayama, JP;
Hidefumi Fujita, Okayama, JP;
Tatsuya Ibaraki, Okayama, JP;
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Abstract
A metal powder for a conductive paste has an average particle diameter D50 not greater than 5 μm and an X value defined by equation (1) not greater than 0.5:value=50 (μm)/BET specific surface area (m/g)  (1)The metal powder for a conductive paste is particularly preferable when wart-like projections of a diameter not greater than 150 nm are present on the particle surfaces. Typical types of the metal powder include Cu, Ag, Au, Pd, Pt, Ni, Al and alloys thereof. The metal powder for a conductive paste enables fabrication of a conductor having a low void ratio after the paste is fired.